Using e-Discovery Technology to Avoid Inadvertent Disclosure

TASA ID: 4285

There have been many articles written on the topic of inadvertent disclosure of privileged information  in litigation, but in Legal Support Partners (LSP) and TASA’s practice of providing e-Discovery services, there are still mistakes being made in how technology is used (or not) in the identification of privileged documents in electronically stored information (ESI). For this reason, it might be helpful to describe some of the e-Discovery tools that can be leveraged to identify privileged communication within a company’s ESI collection to reduce the risk of inadvertent disclosure . . .
Category: Manufacturing

New Trends in Wire Bond Packaging

TASA ID: 4595

As new high-speed products with ever-increasing capabilities are developed and introduced into the market, new advanced IC packaging designs and methods also must be developed to meet these new products’ requirements. New advanced packages are being designed to maximize I/O numbers, minimize wire bond loop length, and provide System-In-Package (SiP) performance. Stacked die packages, providing (SiP) performance, are already the mainstream of cellular phone manufacturing. Wire bonded Lead-On-Chip (LOC, FBGA) packages are the largest production volume portion of the DDR I memory market, and will be the dominant package type through the DDR II generation1
Category: Manufacturing

Very Fine Pitch Wire Bonding: Re-Examining Wire, Bonding Tool and Wire Bonder Interrelationships for Optimum Process Capability

TASA ID: 4595

Through continuous improvements, wire bonding remains the dominant interconnection method. The demand to reduce die size and increase functionality (conserving valuable silicon real estate and increasing the number of interconnects) continues. This has accelerated a decrease in the pitch and size of interconnects. Today’s leading edge production devices are gold ball bonded with 60 mm (bond pad) pitch and wedge bonded with 50 mm pitch. In the near future, gold ball bonding will approach 40 mm pitch and wedge bonding will approach 30 mm. As the pitch and size of the interconnections (bond pads) have decreased, the interrelationship of the various process inputs on each other has increased.

Economic Damage Claims in the Entertainment Industry - Speculative or Beyond a Reasonable Certainty

TASA ID: 3919

The large majority of lawsuits that involve individuals in the entertainment industry revolve around lost wages or fees.  These claims often allege millions of dollars in lost earnings depending on the role the person plays within the industry.  Given the exorbitant amount that some actors, writers, directors and producers earn, it's easy to understand how often these claims get made.  However, the operative word in this scenario is some.

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