Category: Manufacturing Very Fine Pitch Wire Bonding: Re-Examining Wire, Bonding Tool and Wire Bonder Interrelationships for Optimum Process Capability TASA ID: 4595 Through continuous improvements, wire bonding remains the dominant interconnection method. The demand to reduce die size and increase functionality (conserving valuable silicon real estate and increasing the number of interconnects) continues. This has accelerated a decrease in the pitch and size of interconnects. Today’s leading edge production devices are gold ball bonded with 60 mm (bond pad) pitch and wedge bonded with 50 mm pitch. In the near future, gold ball bonding will approach 40 mm pitch and wedge bonding will approach 30 mm. As the pitch and size of the interconnections (bond pads) have decreased, the interrelationship of the various process inputs on each other has increased. Read more
