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Online Jury Verdicts and Settlements Made Easy

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Do you know what your case is worth? Does opposing counsel know? In the beginning stages of a legal suit, your answer is often "No." Plaintiff's counsel creates the value of a case when preparing the complaint. Thereafter, defense counsel completes a review of the materials and evaluates the claim based on the information and documentation initially provided.
Category: Manufacturing

Wire Bonding

TASA ID: 4595

The dominant process for interconnecting semiconductor chips to the outside world is an ultrasonic welding process called wire bonding. More than 90% of the chip interconnections produced annually (more than 15 trillion wires) are produced with this process. Welding is a process where an intermetallic alloy is formed from the materials to be joined. Generally, intermetallic alloys are stronger and also more brittle than their constituents.  Welding is superior to other joining methods, such as soldering which require that a low melting temperature material melt and solidify within the joint. Low melting temperature materials, such as solders have significantly lower strength and are more subject to creep and fatigue failures than intermetallics.
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